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| EN71PL03280 Purpose Eon Silicon Solution Inc. (hereinafter called "Eon") is going to provide its products' top marking on ICs with < cFeon > from January 1st, 2009, and without any change of the part number and the compositions of the ICs. Eon is still keeping the promise of quality for all the products with the same as that of Eon delivered before. Please be advised with the change and appreciate your kindly cooperation and fully support Eon's product family. Eon products' New Top Marking cFeon Top Marking Example: cFeon Part Number: XXXX-XXX Lot Number: XXXXX Date Code: XXXXX Continuity of Specifications There is no change to this data sheet as a result of offering the device as an Eon product. Any changes that have been made are the result of normal data sheet improvement and are noted in the document revision summary, where supported. Future routine revisions will occur when appropriate, and changes will be noted in a revision summary. Continuity of Ordering Part Numbers Eon continues to support existing part numbers beginning with "Eon" and "cFeon" top marking. To order these products, during the transition please specify "Eon top marking" or "cFeon top marking" on your purchasing orders. For More Information Please contact your local sales office for additional information about Eon memory solutions. This Data Sheet may be revised by subsequent versions 1 or modifications due to changes in technical specifications. (c)2004 Eon Silicon Solution, Inc., www.eonssi.com Rev. A, Issue Date: 2009/5/5 EN71PL03280 EN71PL032 Base MCP Stacked Multi-Chip Product (MCP) Flash Memory and RAM 32 Megabit (2M x 16-bit) CMOS 3.0 Volt-only Simultaneous Operation Page Mode Flash Memory and 8 Megabit (512K x 16-bit) Pseudo Static RAM Distinctive Characteristics MCP Features Power supply voltage of 2.7 V to 3.3V High performance - 70 ns Package - 7 x 9 x 1.2mm 56 ball FBGA Operating Temperature - 25C to +85C General Description The EN71PL series is a product line of stacked Multi-Chip Product (MCP) packages and consists of: EN29PL032 (Simultaneous Read/Write) Flash memory die. Pseudo SRAM. For detailed specifications, please refer to the individual datasheets listed in the following table. Device NOR Flash Pseudo SRAM Document EN29PL032 ENPSL80 Product Selector Guide 32Mb Flash Memory Device-Model# Flash Access time EN71PL03280 70ns pSRAM density pSRAM Access time pSRAM time Page read Access 8M pSRAM 70ns 25ns Page read Access time 25ns Package 56 FBGA This Data Sheet may be revised by subsequent versions 2 or modifications due to changes in technical specifications. (c)2004 Eon Silicon Solution, Inc., www.eonssi.com Rev. A, Issue Date: 2009/5/5 EN71PL03280 MCP Block Diagram This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 3 (c)2004 Eon Silicon Solution, Inc., www.eonssi.com Rev. A, Issue Date: 2009/5/5 EN71PL03280 Connection Diagram MCP EN71PL03280 Flash-only Addresses A20, A19 Shared Addresses A18 - A0 Note: A9 = VID for HV Autoselect mode is not available for MCP product. This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 4 (c)2004 Eon Silicon Solution, Inc., www.eonssi.com Rev. A, Issue Date: 2009/5/5 EN71PL03280 Pin Description Signal A20-A0 DQ15-DQ0 CE1#f CE1#ps CE2ps OE# WE# RY/BY# UB# LB# RESET# WP#/ACC VCCf VCCps VSS NC Description 21 Address Inputs (Common) 16 Data Inputs/Outputs (Common) Chip Enable 1 (Flash) Chip Enable 1 (pSRAM) Chip Enable 2 (pSRAM) Output Enable (Common) Write Enable (Common) Ready/Busy Output (Flash) Upper Byte Control (pSRAM) Lower Byte Control (pSRAM) Hardware Reset Pin, Active Low (Flash) Hardware Write Protect/Acceleration Pin (Flash) Flash 3.0 volt-only single power supply pSRAM Power Supply Device Ground (Common) Pin Not Connected Internally Note: A9 = VID for HV Autoselect mode is not available for MCP product. Logic Symbol This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 5 (c)2004 Eon Silicon Solution, Inc., www.eonssi.com Rev. A, Issue Date: 2009/5/5 EN71PL03280 ORDERING INFORMATION EN71PL032 80 70 C W P PACKAGING CONTENT (Blank) = Conventional P = Pb Free TEMPERATURE RANGE W = Wireless (-25C to +85C) PACKAGE C =56-Ball Fine Pitch Ball Grid Array (FBGA) 0.80mm pitch, 7mm x 9mm package SPEED 70 = 70ns pSRAM density 80 = 8M pSRAM BASE PART NUMBER EN = Eon Silicon Solution Inc. 71PL = Multi-chip Product (MCP) 3.0V Simultaneous Read/Write, Page Mode Flash Memory and RAM 032 = 32 Megabit (2M x 16) This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 6 (c)2004 Eon Silicon Solution, Inc., www.eonssi.com Rev. A, Issue Date: 2009/5/5 EN71PL03280 PACKAGE MECHANICAL 56-ball Fine-Pitch Ball Grid Array (FBGA) 7 x 9 mm Package SYMBOL A A1 A2 D E D1 E1 e DIMENSION IN MM MIN. --0.25 0.61 6.90 8.90 ------NOR --0.30 0.66 7.00 9.00 5.60 5.60 0.80 0.40 MAX 1.20 0.35 0.71 7.10 9.10 ------0.45 b 0.35 Note : 1. Coplanarity: 0.1 mm This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 7 (c)2004 Eon Silicon Solution, Inc., www.eonssi.com Rev. A, Issue Date: 2009/5/5 EN71PL03280 Revisions List Revision No A Description Initial Release Date 2009/05/05 This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 8 (c)2004 Eon Silicon Solution, Inc., www.eonssi.com Rev. A, Issue Date: 2009/5/5 |
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